
Product Inspection Equipment
Wafer Marking Inspection
CR-WMI10 - For checking top and bottom kerf's width of wafer and its relation to the marking on the other side.

Feature:
1.For checking top and bottom kerf's width of wafer and its relation to the marking on the other side.
2.Can observe top view and bottom view immediately.
3.Can observe mix of top and bottom view.
4.Can adjust the brightness, contrast of the picture. Can enhance image appearance or detail.
5.50X optical magnification, 1-10 digital magnification.
6.Crosshair and calibration circle is provided for simplified measurement.
7.Real time image flipping for viewing needs.
8.Can save or load images.